Samsung has the new UFS 3.0 flash memory for smartphones ready: twice as fast and with capacities up to 1TB

Samsung is unstoppable in the development of flash chips, since only a few weeks ago he presented us with his 1TB memory unit for smartphones, which is based on UFS 2.1 technology. Now Samsung is finally announcing the start of production of its first flash memory modules under the UFS 3.0 standard , which was introduced a year ago.

One of the biggest advantages of UFS 3.0 technology is its transfer rates, which would reach up to 2.4 Gbps (read), that is, up to 20 times faster than a microSD and four times faster than a SATA unit . In fact, the recently introduced Galaxy Fold will be the first device to have UFS 3.0 memory of 512GB, which is precisely the first module that is entering production.

Modules of 128 and 512 GB this month and 256 GB and 1 TB for the second half of the year
Samsung has been the pioneer in the development of this technology with the launch of eUFS of 128 GB in January 2015 , which emerged as an evolution to the famous eMMC and that offered us a jump in speed up to 350 Mbps in reading and 150 Mbps in writing .

Over the years, Samsung has been updating both the standard and the capabilities, which led us until a few days ago to UFS 2.1 of 1TB , which assure us that it will offer read speeds of up to 1000 Mbps and 260 Mbps for writing. Now with the start of production of the 512GB UFS 3.0 module, the above is doubled with theoretical read speeds of up to 2100 Mbps and 410 Mbps write speed . That is to say, we still have not reached that theoretical speed of 2.4 Gbps that they promised, but the jump is still important.

Another advantage of UFS 3.0 is its ability to use dual channel with 11.6 Gbps each, that is, maximum speed doubled , in addition to monitoring errors and more secure transfers. According to Samsung, this new technology will bring us smartphones with larger and higher resolution screens, as well as flexible and collapsible screens.

Samsung confirmed that right now, in February, they have started with the production of the UFS 3.0 chips of 128 and 512 GB , which are already available for manufacturers to use in their devices. While the modules of 256 GB and 1 TB will begin to manufacture during the second half of the year.